Push plate, mounting assembly, circuit board, and method of assembling thereof for ball grid array packages
| DWPI Title: Push plate for securing e.g. ball grid array package, to package holder test pad, has frame portion for applying downward force upon package in direction towards package test pad or printed circuit board when plate is attached to pad |
| Abstract: A push plate that includes springs in the form of cantilever flexures and an inspection window is disclosed. The push plate provides a known, uniform, down force and minimal torque to a package to be tested. The cantilevers have a known, calculable down force producing stiffness. The window provides for viewing of the package during testing. |
| Use: Push plate for securing a package i.e. ball grid array package such as multi-chip module, microprocessor and application specific integrated circuit, to a package holder test pad or printed circuit board. |
| Advantage: The plate attaches the ball grid array package to the circuit board or test socket that allows for direct probing of the package and that applies an even down force to the package while enabling unfettered access to a top side of the multi-chip module package. The plate facilitates a central slit length to be lengthened or shortened to produce a desired torque stiffness to minimize torque while providing a calibrated down force. |
| Novelty: The plate (400) has a frame portion surrounding a window portion. Springs flex for allowing the window portion to flex within the frame portion to control an amount of torque applied to a package. The frame portion comprises openings for receiving a force adjustable fixture for securing the plate to a package holder test pad or printed circuit board. The frame portion applies a downward force upon the package in a direction towards the package holder test pad or printed circuit board when the plate is attached to the package holder test pad or printed circuit board. |
| Filed: 2/14/2013 |
| Application Number: US13767578A |
| Tech ID: SD 12125.1 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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