System on chip module configured for event-driven architecture
| DWPI Title: Computing device such as mobile telephone, has hardware logic module is configured to generate second output event message responsive to being triggered |
| Abstract: A system on chip (SoC) module is described herein, wherein the SoC modules comprise a processor subsystem and a hardware logic subsystem. The processor subsystem and hardware logic subsystem are in communication with one another, and transmit event messages between one another. The processor subsystem executes software actors, while the hardware logic subsystem includes hardware actors, the software actors and hardware actors conform to an event-driven architecture, such that the software actors receive and generate event messages and the hardware actors receive and generate event messages. |
| Use: Computing device such as mobile telephone and mobile media device. |
| Advantage: The process can be configured to generate a new event message for transmittal to an operator to inform the operator that the temperature is too high. The first process and the first hardware logic module can be configured to be redundant, in that they perform the same functionality. The software and hardware actors can be substituted for each other to meet reliability or performance requirements for a particular context. |
| Novelty: The device has a hardware logic subsystem (104) comprises event broker logic is configured to detect receipt of a predefined second event message at the hardware logic subsystem. The event broker logic (122) is further configured to trigger operation of the hardware logic module responsive to the event broker logic detecting receipt of the predefined second event message. The hardware logic module is configured to generate a second output event message responsive to being triggered. The processor subsystem (102) and the hardware logic subsystem are configured to communicate with one another. |
| Filed: 4/21/2015 |
| Application Number: US14691769A |
| Tech ID: SD 12887.0 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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