Flexible packaging for microelectronic devices
| DWPI Title: Flexible microsystems enabled microelectronic device package for packaging photovoltaic solar cell for e.g. residential application, has reinforcing layer coupled to protective layer, where substrate and reinforcing layer form package |
| Abstract: An apparatus, method, and system, the apparatus and system including a flexible microsystems enabled microelectronic device package including a microelectronic device positioned on a substrate; an encapsulation layer encapsulating the microelectronic device and the substrate; a protective layer positioned around the encapsulating layer; and a reinforcing layer coupled to the protective layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device. The method including encapsulating a microelectronic device positioned on a substrate within an encapsulation layer; sealing the encapsulated microelectronic device within a protective layer; and coupling the protective layer to a reinforcing layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device. |
| Use: Flexible microsystems enabled microelectronic device package for packaging microelectronic device i.e. photovoltaic solar cell claimed, for application e.g. residential application, commercial application and utility scale solar power installation application. |
| Advantage: The package encapsulates the electronic devices and provides mechanical robustness, moisture resistance and a high degree of flexibility to the assembly of electronic devices in an efficient manner. The package allows material for adhesive layer to be flexible and elastomeric such that flexibility of the packaging is improved. |
| Novelty: The package has microelectronic devices (102A-102F) positioned on a substrate (204). An encapsulation layer (302) encapsulates the microelectronic device and the substrate. A protective layer (402) is positioned around the encapsulating layer. A reinforcing layer (902) is coupled to the protective layer, where the substrate, encapsulation layer, protective layer and reinforcing layer form the package around the microelectronic device. The protective layer comprises a moisture resistant material that protects the microelectronic device from moisture. |
| Filed: 10/31/2013 |
| Application Number: US14068189A |
| Tech ID: SD 12829.0 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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