High resolution, non-contact removal rate module for serial sectioning

DWPI Title: Metallographic system has polisher to polish first top surface of sample to provide second top surface, and robotic arm which moved sample between sensor, analyzer, and polisher, in which analyzer examines first top surface of sample
Abstract: The present invention relates to a metallographic system including a measurement module configured to provide precise differential measurements of a sample after serial sectioning, as well as methods of employing such a module. In particular example, the measurement module provides differential measurement(s) without contacting the surface of a sample, thereby minimizing contamination of the sample surface.
Use: Metallographic system.
Advantage: Provides more accurate distance measurements, which can improve data resolution, enhance data accuracy, or minimize errors. Greatly heightens repeatability and increased data collection rates, while diminishing opportunity for mishandling and other user-introduced errors.
Novelty: The metallographic system (100) has a robotic arm (101) to manipulate a sample (103) and to present a first top surface of the sample, a sensor to measure a reference distance between the sensor and a portion of the reference surface and to measure a sample distance (112) between the sensor and a portion of the first top surface of the sample. An analyzer (130) examines the first top surface of the sample. The polisher (120) polishes the first top surface of the sample to provide a second top surface. The robotic arm moves the sample between the sensor, the analyzer, and the polisher.
Filed: 9/14/2017
Application Number: US15705178A
Tech ID: SD 13742.1
This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention.
Data from Derwent World Patents Index, provided by Clarivate
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