High-temperature, adhesive-based microvalves and uses thereof
| DWPI Title: Normally-open microvalve assembly, has energy source that is configured to provide melted adhesive material thus allowing melted adhesive material to block fluidic opening in order to minimize fluidic communication between two chambers |
| Abstract: The present invention relates to adhesive-based microvalves, as well as assemblies and cartridges having such microvalves. In particular examples, substantially planar layers of adhesive materials are used to construct both normally-open and normally-closed microvalves for fluid control within microfluidic laminate cartridges. Such microvalves and cartridges can be useful for medical, chemical, and biological investigations. |
| Use: Normally-open microvalve assembly. |
| Advantage: The heater is activated for a sufficient time and at a sufficient power to allow the meltable element to melt. The cartridge of the assembly is arrangeble, thus facilitating single-use detection of samples that can be easily contaminated or can be potentially hazardous. |
| Novelty: The normally-open microvalve assembly has a first chamber (561) that is arranged in a first layer. A planar layer is arranged between the first layer and the intermediate layer. The adhesive material has a melting temperature from about 100° C to about 250° C. The planar layer comprises a removed portion and a meltable element. The meltable element is arranged in proximity to the fluidic opening. The removed portion provides an edge that forms a portion of the first chamber. An energy source is in contact with portion of the meltable element. The energy source is configured to provide a melted adhesive material thus allowing the melted adhesive material to block the fluidic opening in order to minimize fluidic communication between the first and second chambers (562). |
| Filed: 7/16/2014 |
| Application Number: US14332831A |
| Tech ID: SD 12291.0 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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