Planar electrode arrays and fabrication methods thereof
| DWPI Title: Method of fabricating electrode array, involves depositing bonding layer on portion of top surface of dielectric layer, adhering device wafer to top surface of bonding layer, removing handle wafer, thus forming planar device |
| Abstract: The present invention relates to a method of fabricating an electrode array, in which an underlying handle wafer is removed to provide a planar device having the electrode array. Also provided are wafers including a plurality of planar devices having an electrode array, as well as sensors including such an electrode array. |
| Use: Method of fabricating electrode array e.g. planar, monolithic mult ielectrode array. |
| Advantage: The density of electrodes can provide improved signal resolution and enhanced spatial resolving power. The interfering effects of a dielectric between the surface, are minimized, and better emulates a freely corroding surface . |
| Novelty: The method involves providing multiple electrodes (14A-14I) and multiple bond pads that are placed on a top surface of a handle wafer which has a dielectric layer (12) to isolate electrodes and bond pads. A first metal is deposited to form a connector (15A-15C) and forms an electrical connection between one of multiple electrodes and one of multiple bond pads. A bonding layer (16) is deposited on a portion of a top surface of the dielectric layer. A device wafer is adhered to a top surface of the bonding layer. The handle wafer is removed, thus forming a planar device. The planar device is provided with the device wafer. The bonding layer is placed on a surface of the device wafer, and an electrode array is placed within the dielectric layer. The electrode array is provided with one of multiple electrodes, one of multiple bond pads, and the connector that is configured to form the electrical connection between the one of multiple electrodes and one of multiple bond pads. |
| Filed: 2/6/2019 |
| Application Number: US16268806A |
| Tech ID: SD 14386.1 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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