Modular assemblies and systems for cell cultures and methods thereof
| DWPI Title: Modular assembly useful for conducting cell analyses, comprises transferrable cell culture insert, top housing, bottom housing, top sealing layer, bottom sealing layer, and fastener disposed within the top housing |
| Abstract: The present invention relates to modular assemblies and systems for conducting cell analyses. In particular embodiments, an assembly has micron-scale fluidic structures, thereby minimizing sample use, and possesses a modular architecture that facilitates disassembly of the apparatus. Thus, one such modular assembly facilitates on-chip cell growth and on-chip assays; and then, as needed, the assembly can be disassembled to provide direct access to the cells that were incubated and treated within the chip. Methods of making and using such assemblies, as well as systems thereof, are further described herein. |
| Use: The assembly is useful for conducting cell analyses. |
| Advantage: The assembly: has micron-scale fluidic structures, thus minimizing sample use; and possesses a modular architecture that facilitates disassembly of the apparatus. |
| Novelty: Modular assembly (A1) (100) comprises: a transferrable cell culture insert, where the transferrable insert comprises a handling layer; a top housing (111) comprising at least one access port, where at least one access port is in fluidic communication with the cell culture membrane; a bottom housing (112); a top sealing layer (131) disposed between the top housing and the transferrable insert; a bottom sealing layer (141) disposed between the transferrable insert and the bottom housing; and at least one fastener disposed within the top housing, within the bottom housing, and/or between the top and bottom housing, where the top and bottom housing are configured to be reversibly detached, thus facilitating transfer of the transferrable insert. |
| Filed: 9/22/2016 |
| Application Number: US15273408A |
| Tech ID: SD 12792.1 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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