Miniaturized vacuum package and methods of making same
| DWPI Title: Integrated package comprises an integrated component comprising an active area, an electrical routing circuit, and an optical routing circuit, where the active area is equipped in proximity to top surface of a substrate, and electrical and optical routing circuits are equipped within the substrate |
| Abstract: The present disclosure relates to an integrated package having an active area, an electrical routing circuit, an optical routing circuit, and a vacuum vessel. Methods of making such a package are also described herein. |
| Use: Integrated package. |
| Advantage: The integrated package facilitates electrical and optical access to active areas of a device, while also providing the active area with a controlled, vacuum environment. In particular, the package employs an integrated component having embedded electrical and optical routing circuits. |
| Novelty: Integrated package comprises an integrated component (110) comprising an active area (114), an electrical routing circuit (116), and an optical routing circuit (118), where the active area is equipped in proximity to a top surface of a substrate (112). The electrical and optical routing circuits are equipped within the substrate below the top surface. The active area is configured to connect with the electrical and optical routing circuits, a vacuum vessel comprising a cap portion, a pillar portion, and a chamber. The cap portion and the pillar portion are configured to define the chamber. The chamber is configured to be equipped above the active area. A first bonding portion equipped peripherally around the active area. The first bonding portion is equipped between a lower surface of the pillar portion and a top surface of the substrate, and an opening equipped within the substrate, where the opening is configured to provide fluidic communication to the chamber. |
| Filed: 10/13/2021 |
| Application Number: US17500555A |
| Tech ID: SD 15771.0 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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