Thermal measurement apparatus and methods for anisotropic thermal materials
| DWPI Title: Method for characterizing thermal conductivity of heterogeneous anisotropic sample, involves determining portion of sample of which conductivity value is representative based upon measured temperatures of sample at location |
| Abstract: A system for characterizing thermal properties of thermally anisotropic heterogeneous samples includes a heating element, a first temperature sensing device, a second temperature sensing device, and a computing system. The heating element is positioned at a first location within a sample and heats the sample. The first temperature sensing device outputs data indicative of temperatures of the first location to the computing device. The second temperature sensing device outputs data indicative of temperatures of the second location to the computing device. The computing device computes a thermal conductivity of the sample based upon the temperatures of the first location. The computing device further outputs an indication of a portion of the sample to which the thermal conductivity pertains based upon the second temperatures. |
| Use: Method for computing thermal conductivity of heterogeneous anisotropic sample such as layered sample. |
| Advantage: The thermal conductivity of the heterogeneous anisotropic sample can be determined effectively. The thermal dissipation, electrical or thermal insulation, or mechanical shock resistance of the embedded device can be improved. |
| Novelty: The method involves heating a sample at a first location in the sample, and measuring a temperature of the sample at the first location and a second location a number of times. A thermal conductivity value associated with the sample is computed based upon the measured temperatures of the locations. A portion of sample is determined and is representative of the computed value. An indication is outputted that the computed value represents the thermal conductivity of the determined portion. The sample is heated with a transient plane source (TPS) element i.e. hot disk element (200) having a double spiral configuration. |
| Filed: 5/3/2022 |
| Application Number: US17735581A |
| Tech ID: SD 15115.1 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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