Multi-chip photonics transceiver

DWPI Title: Photonics transceiver, has wavelength division multiplexer provided with tunable ring resonators, where each of tunable ring resonators is optically coupled to one of light sources, and receiver componentry provided with wavelength division demultiplexer
Abstract: A photonics transceiver is described herein, wherein the photonics transceiver exhibits improved areal bandwidth density and improved energy per bit consumption relative to conventional photonics transceivers. The photonics transceiver achieves an areal bandwidth density of at least 5 Tbps/mm2 with an energy consumption of less than 500 fJ/bit (sum of energy consumed for both a transmitted bit and a received bit). The photonics transceiver is a multi-chip module, where chips in the multi-chip module are tightly integrated with one another. The multi-chip module includes light source, photodetector, photonics, and control/logic chips. The photonics chip includes transparent conducting oxide integrated optical modulators and multiplexers and demultiplexers based on MEMS-tunable optical ring resonators.
Use: Photonics transceiver.
Advantage: The control/logic chip can be efficiently connected to the photonics integrated circuit chip by way of high density, low capacitance flip-chip bonding. The photonics transceiver can utilize a forwarded clock archecture, implemented with a transmitted clock pattern over an additional wavelength that is shared by data channels, to provide improved high-frequency jitter tolerance without any additional clock-and-data recovery phase detectors.
Novelty: The transceiver has a first chip provided with light sources. Each of the light sources adapted to continuously emit a corresponding wavelength of light. Each of the light sources is provided with corresponding vertical cavity surface emitting laser (VCSEL). The VCSELs are formed on a non-planar substrate. The non-planar substrate is provided with a ridge. A second chip is provided with photodetectors. Each of photodetector is adapted to produce a corresponding signal indicative of a received magnitude of light. A third chip is provided with a transmitter componentry including a wavelength division multiplexer. The wavelength division multiplexer is provided with tunable ring resonators. Each of the tunable ring resonators is optically coupled to one of the light sources. A receiver componentry is provided with a wavelength division demultiplexer.
Filed: 8/2/2021
Application Number: US17391167A
Tech ID: SD 15105.1
This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention.
Data from Derwent World Patents Index, provided by Clarivate
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