Vertically integrated optoelectronics package for MEMS devices

Patent Number: 10,139,564
Issued: 11/27/2018
Official Filing: View the Complete Patent
Abstract: The present application relates to vertically integrated assemblies including a MEMS-based optomechanical architecture. In some embodiments, the assembly includes a MEMS/optoelectronic module, an emitter module, and a detector module, where these modules are vertically integrated. Methods of fabricating such assemblies are also described herein.
Filed: 1/28/2016
Application Number: 15/9,153
Government Interests: STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention.