Vertically integrated optoelectronics package for MEMS devices
| Patent Number: | 10,139,564 |
| Issued: | 11/27/2018 |
| Official Filing: | View the Complete Patent |
| Abstract: | The present application relates to vertically integrated assemblies including a MEMS-based optomechanical architecture. In some embodiments, the assembly includes a MEMS/optoelectronic module, an emitter module, and a detector module, where these modules are vertically integrated. Methods of fabricating such assemblies are also described herein. |
| Filed: | 1/28/2016 |
| Application Number: | 15/9,153 |
| Government Interests: | STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |