Systems and methods for shock-resistant memory devices

DWPI Title: Data retrieval system for preserving data for retrieval subsequent to high-shock event in shock resistant memory device in spacecraft includes wire running along surface of balloon and connecting antenna to transmitter
Abstract: A shock-resistant memory device comprises a housing and a memory module. The memory module is disposed within the housing and surrounded by potting material to protect the memory module from damage during a shock event. The housing can include a port that accommodates a data connection between the memory module and a sensor from which data is desirably received by the memory module. During a shock event the connection between the memory module and the sensor may be severed, but data stored in the memory module can be retained in the memory module which is protected by the housing. To facilitate retrieval of the memory device subsequent to a shock event, a balloon can be affixed to the housing. The balloon can be configured to inflate subsequent to the shock event so that the shock-resistant memory device does not sink in water and to make the memory device more visible for recovery.
Use: Data retrieval system for preserving data for retrieval subsequent to high-shock event in shock resistant memory device (claimed) in spacecraft.
Advantage: The data stored in the memory module is safely retained in the memory module and protected by the housing when connection between the memory module and the sensor is severed during high-shock event. Provides balloon that can withstand the stresses of the shock-resistant memory device subjected to high-shock event, and the subsequent stresses of inflation and exposure to the elements.
Novelty: The data retrieval system includes electronics package (104) arranged within the interior cavity (110) of the housing (102), and contains transmitter and memory module. The memory module stores data for retrieval subsequent to high-shock event. A potting material (112) is arranged within the housing and surrounds the electronics package such that the electronics package is suspended in the potting material. A balloon (130) is affixed to the housing to inflate subsequent to the high-shock event. An antenna (406) is attached to the surface of the balloon. A wire runs along the surface of the balloon and connects the antenna to the transmitter. The transmitter transmits beacon signal by way of the antenna in response to the deployment of the balloon.
Filed: 7/2/2019
Application Number: US16460388A
Tech ID: SD 14478.1
This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention.
Data from Derwent World Patents Index, provided by Clarivate
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