SILVER THICK FILM PASTE HERMETICALLY SEALED BY SURFACE THIN FILM MULTILAYER
| Patent Number: | 9,648,740 |
| Issued: | 5/9/2017 |
| Official Filing: | View the Complete Patent |
| Application Number: | 502,745/14 |
| Government Interests: | STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |