Planar electrode arrays and fabrication methods thereof

Patent Number: 10,969,359
Issued: 4/6/2021
Official Filing: View the Complete Patent
Abstract: The present invention relates to a method of fabricating an electrode array, in which an underlying handle wafer is removed to provide a planar device having the electrode array. Also provided are wafers including a plurality of planar devices having an electrode array, as well as sensors including such an electrode array.
Filed: 2/6/2019
Application Number: 16/268,806
Government Interests: STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention.