| Abstract: The integration of surface acoustic wave (SAW) filters, microfabricated
transmission lines, and sensors onto polymer substrates in order to
enable a passive wireless sensor platform is described herein. Incident
microwave pulses on an integrated antenna are converted to an acoustic
wave via a SAW filter and transmitted to an impedance based sensor, which
for this work is a photodiode. Changes in the sensor state induce a
corresponding change in the impedance of the sensor resulting in a
reflectance profile. Data collected at a calibrated receiver is used to
infer the state of the sensor. Based on this principal, light levels were
passively and wirelessly demonstrated to be sensed at distances of up to
about 12 feet. |
| Filed: 5/11/2010 |
| Application Number: 12/777355 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
| Attribution for Derwent World Patents Index Records published on Sandia ® Clarivate. All rights reserved. Republication or redistribution of Clarivate content, including by framing or similar means, is prohibited without the prior written consent of Clarivate. Clarivate and its logo, as well as all other trademarks used herein are trademarks of their respective owners and used under license. |