| Abstract: Disclosed herein are methods of making micropores of a desired height
and/or width between two isotropic wet etched features in a substrate
which comprises single-level isotropic wet etching the two features using
an etchant and a mask distance that is less than 2.times. a set etch
depth. Also disclosed herein are methods using the micropores and
microfluidic devices comprising the micropores. |
| Filed: 10/18/2013 |
| Application Number: 14/57170 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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