Methods for integrating a functional component into a microfluidic device
| Patent Number: | 8,808,588 |
| Issued: | 8/19/2014 |
| Official Filing: | View the Complete Patent |
| Abstract: | Injection molding is used to form microfluidic devices with integrated functional components. One or more functional components are placed in a mold cavity, which is then closed. Molten thermoplastic resin is injected into the mold and then cooled, thereby forming a solid substrate including the functional component(s). The solid substrate including the functional component(s) is then bonded to a second substrate, which may include microchannels or other features. |
| Filed: | 2/4/2008 |
| Application Number: | 12/12,653 |
| Government Interests: | STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |