| Abstract: Injection molding is used to form microfluidic devices with integrated
functional components. One or more functional components are placed in a
mold cavity, which is then closed. Molten thermoplastic resin is injected
into the mold and then cooled, thereby forming a solid substrate
including the functional component(s). The solid substrate including the
functional component(s) is then bonded to a second substrate, which may
include microchannels or other features. |
| Filed: 2/4/2008 |
| Application Number: 12/12653 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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