METHOD FOR ATOMIC LAYER DEPOSITION

Patent Number: 9,605,344
Issued: 3/28/2017
Official Filing: View the Complete Patent
Application Number: 917,566/14
Government Interests: STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention.