| Abstract: A modular, scalable focal plane array is provided as an array of
integrated circuit dice, wherein each die includes a given amount of
modular pixel array circuitry. The array of dice effectively multiplies
the amount of modular pixel array circuitry to produce a larger pixel
array without increasing die size. Desired pixel pitch across the
enlarged pixel array is preserved by forming die stacks with each pixel
array circuitry die stacked on a separate die that contains the
corresponding signal processing circuitry. Techniques for die stack
interconnections and die stack placement are implemented to ensure that
the desired pixel pitch is preserved across the enlarged pixel array. |
| Filed: 6/20/2011 |
| Application Number: 13/163909 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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