| Abstract: A method including providing a substrate comprising a device layer on
which a plurality of device cells are defined; depositing a first
dielectric layer on the device layer and metal interconnect such that the
deposited interconnect is electrically connected to at least two of the
device cells; depositing a second dielectric layer over the interconnect;
and exposing at least one contact point on the interconnect through the
second dielectric layer. An apparatus including a substrate having
defined thereon a device layer including a plurality of device cells; a
first dielectric layer disposed directly on the device layer; a plurality
of metal interconnects, each of which is electrically connected to at
least two of the device cells; and a second dielectric layer disposed
over the first dielectric layer and over the interconnects, wherein the
second dielectric layer is patterned in a positive or negative planar
spring pattern. |
| Filed: 6/19/2015 |
| Application Number: 14/745251 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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