| Abstract: | A method including providing a substrate comprising a device layer on
which a plurality of device cells are defined; depositing a first
dielectric layer on the device layer and metal interconnect such that the
deposited interconnect is electrically connected to at least two of the
device cells; depositing a second dielectric layer over the interconnect;
and exposing at least one contact point on the interconnect through the
second dielectric layer. An apparatus including a substrate having
defined thereon a device layer including a plurality of device cells; a
first dielectric layer disposed directly on the device layer; a plurality
of metal interconnects, each of which is electrically connected to at
least two of the device cells; and a second dielectric layer disposed
over the first dielectric layer and over the interconnects, wherein the
second dielectric layer is patterned in a positive or negative planar
spring pattern. |