| Abstract: | The various technologies presented herein relate to formation of carbon
micromechanical systems (CMEMS), wherein the CMEMS comprise multiple
layers of carbon structures and are formed using a plurality of
photoresist precursors that are processed to form carbon. The various
embodiments can be utilized in producing a plurality of CMEMS with full
production level fabrication, e.g., 6 inch wafers can be processed. A
pyrolyzed layer of carbon is lithographically defined after pyrolysis,
wherein the post-pyrolysis etch process can produce carbon structures
having repeatable and accurate device geometries, with straight
sidewalls. A sacrificial layer can be applied to facilitate separation of
a first carbon layer from a second carbon layer, wherein, upon pyrolysis
to form the second carbon layer and lithography thereof, the sacrificial
layer is removed to form a CMEMS comprising a first carbon layer (e.g.,
comprising bottom contacts) located beneath a second carbon layer (e.g.,
a mechanical layer). |