Electroplated Au for Conformal Coating of High Aspect Ratio Silicon Structures

Patent Number: 11,053,601
Issued: 7/6/2021
Official Filing: View the Complete Patent
Application Number: 174,744/16
Government Interests: STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention.