Electroplated Au for Conformal Coating of High Aspect Ratio Silicon Structures
| Patent Number: | 11,053,601 |
| Issued: | 7/6/2021 |
| Official Filing: | View the Complete Patent |
| Application Number: | 174,744/16 |
| Government Interests: | STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |