| Abstract: A method for electroplating a nonmetallic grating including providing a
nonmetallic grating; performing an atomic layer deposition (ALD) reaction
to form a seed layer on the nonmetallic grating; and electroplating a
metallic layer on the seed layer such that the metallic layer uniformly
and conformally coats the nonmetallic grating. An apparatus including a
silicon substrate having gratings with an aspect-ratio of at least 20:1;
a atomic layer deposition (ALD) seed layer formed on the gratings; and an
electroplated metallic layer formed on the seed layer, wherein the
electroplated metallic layer uniformly and conformally coats the
gratings. |
| Filed: 11/15/2013 |
| Application Number: 14/81342 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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