Apparatus and method for controlling plating uniformity
| Patent Number: | 6,802,950 |
| Issued: | 10/12/2004 |
| Official Filing: | View the Complete Patent |
| Abstract: | The use of an insulating shield for improving the current distribution in an electrochemical plating bath is disclosed. Numerical analysis is used to evaluate the influence of shield shape and position on plating uniformity. Simulation results are compared to experimental data for nickel deposition from a nickel--sulfamate bath. The shield is shown to improve the average current density at a plating surface. |
| Filed: | 11/26/2002 |
| Application Number: | 10/304,175 |
| Government Interests: | STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |