| Abstract: Adhesiveless copper clad laminates wherein a base metal layer is directly
formed on at least one side of an insulating film without using an
adhesive and a copper conductor layer having a desired thickness is
formed on the base metal layer, the adhesiveless copper clad laminates is
characterized in that a base metal layer having a thickness of 3 to 50 nm
is formed on an insulating film by a dry plating method and a copper film
layer is formed on the base metal layer, and the base metal layer mainly
contains (1) a vanadium-molybdenum-nickel alloy consisting of 4 to 13% by
weight of vanadium, 5 to 40% by weight of molybdenum, and the balance of
nickel or (2) a vanadium-chromium-molybdenum-nickel alloy consisting of 4
to 13% by weight of vanadium and chromium in total including at least 2%
by weight of vanadium, 5 to 40% by weight of molybdenum, and the balance
of nickel. |
| Filed: 8/24/2010 |
| Application Number: 12/805921 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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