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Microfluidic package and method of making the same

United States Patent

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10,717,079
July 21, 2020
View the Complete Patent at the US Patent & Trademark Office
The present invention relates to encapsulated microfluidic packages and methods thereof. In particular embodiments, the package includes a device, a cradle configured to support the device, and a lid having a bonding surface configured to provide a fluidic seal between itself and the device and/or cradle. Other package configurations, as well as methods for making such fluidic seals, are described herein.
15/415,675
January 25, 2017
1/1;
B01L 3/00 (20060101);
STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under contract no. DE-AC04-94AL85000 awarded by the U.S. Department of Energy to Sandia Corporation. The Government has certain rights in the invention.