Licensing Opportunity Contact Form
Submission of this form should not be interpreted as an offer to license technology. All licenses are subject to negotiation and availablility of the intellectual property for licensing. This form is intended for indications of interest only.
 

Search/Browse Tech

Microfluidic package and method of making the same

United States Patent

To discuss licensing opportunities, fill out our Contact Form 
10,717,079
July 21, 2020
View the Complete Patent at the US Patent & Trademark Office
The present invention relates to encapsulated microfluidic packages and methods thereof. In particular embodiments, the package includes a device, a cradle configured to support the device, and a lid having a bonding surface configured to provide a fluidic seal between itself and the device and/or cradle. Other package configurations, as well as methods for making such fluidic seals, are described herein.
15/ 415,675
January 25, 2017
1/1
B01L 3/00 (20060101)
STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under contract no. DE-AC04-94AL85000 awarded by the U.S. Department of Energy to Sandia Corporation. The Government has certain rights in the invention.