| Abstract: Disclosed is an encapsulated micro-diode and a method for producing same.
The method comprises forming a plurality columns in the substrate with a
respective tip disposed at a first end of the column, the tip defining a
cathode of the diode; disposing a sacrificial oxide layer on the
substrate, plurality of columns and respective tips; forming respective
trenches in the sacrificial oxide layer around the columns; forming an
opening in the sacrificial oxide layer to expose a portion of the tips;
depositing a conductive material in of the opening and on a surface of
the substrate to form an anode of the diode; and removing the sacrificial
oxide layer. |
| Filed: 11/17/2011 |
| Application Number: 13/298448 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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