| Abstract: In wafer-level packaging of microelectromechanical (MEMS) devices a lid
wafer is bonded to a MEMS wafer in a predetermined aligned relationship.
Portions of the lid wafer are removed to separate the lid wafer into lid
portions that respectively correspond in alignment with MEMS devices on
the MEMS wafer, and to expose areas of the MEMS wafer that respectively
contain sets of bond pads respectively coupled to the MEMS devices. |
| Filed: 2/1/2012 |
| Application Number: 13/364166 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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