Micropores and methods of making and using thereof
Patent Number: | 8,585,916 |
Issued: | 11/19/2013 |
Official Filing: | View the Complete Patent |
Abstract: | Disclosed herein are methods of making micropores of a desired height and/or width between two isotropic wet etched features in a substrate which comprises single-level isotropic wet etching the two features using an etchant and a mask distance that is less than 2.times. a set etch depth. Also disclosed herein are methods using the micropores and microfluidic devices comprising the micropores. |
Filed: | 1/21/2009 |
Application Number: | 12/812,986 |
Government Interests: | STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |