| Abstract: | A feedstock material for use in an additive manufacturing apparatus is
prepared from a first material and a metal organic framework (MOF). The
MOF comprises a plurality of nodes and a plurality of linkers, the
plurality of linkers coupled to the plurality of nodes, thereby forming a
framework. The MOF has a lower coefficient of thermal expansion than a
coefficient of thermal expansion for the first material. As a result, the
feedstock material has a reduced coefficient of thermal expansion as
compared to the first material alone and thus exhibits low thermal
expansion as its temperature is increased. The coefficient of thermal
expansion for the MOF may be modified by using a different plurality of
nodes and/or a different plurality of linkers, as well as by
incorporating guest molecules or atoms into the framework of the MOF. |