| Abstract: The present invention relates to a method of fabricating an electrode
array, in which an underlying handle wafer is removed to provide a planar
device having the electrode array. Also provided are wafers including a
plurality of planar devices having an electrode array, as well as sensors
including such an electrode array. |
| Filed: 2/6/2019 |
| Application Number: 16/268806 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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