Lateral vias for connections to buried microconductors and methods thereof
| Patent Number: | 10,262,931 |
| Issued: | 4/16/2019 |
| Official Filing: | View the Complete Patent |
| Abstract: | The present invention relates to a lateral via to provide an electrical connection to a buried conductor. In one instance, the buried conductor is a through via that extends along a first dimension, and the lateral via extends along a second dimension that is generally orthogonal to the first dimension. In another instance, the second dimension is oblique to the first dimension. Components having such lateral vias, as well as methods for creating such lateral vias are described herein. |
| Filed: | 5/15/2018 |
| Application Number: | 15/980,546 |
| Government Interests: | STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |