| Abstract: | A method is provided for making a molded photovoltaic module. The module
includes a flexible polymeric flex-circuit substrate having an
electrically conductive printed wiring pattern and solder pads defined on
it. Small photovoltaic cells are affixed to the flex-circuit substrate by
back-surface contacts in electrical contact with the solder pads. At
least one thermoformable polymeric film is joined to the flex-circuit
substrate. Each said solder pad comprises a solder composition that,
after an initial melt, has a melting point that lies above at least a
portion of the temperature range for thermoforming the polymeric film. |