| Abstract: An apparatus, method, and system, the apparatus including a receiving
member dimensioned to receive an array of microelectronic devices; and a
linkage member coupled to the receiving member, the linkage member
configured to move the receiving member in at least two dimensions so as
to modify a spacing between the electronic devices within the array of
microelectronic devices received by the receiving member. The method
including coupling an array of microelectronic devices to an expansion
assembly; and expanding the expansion assembly so as to expand the array
of microelectronic devices in at least two directions within a single
plane. The system including a support member; an expansion assembly
coupled to the support member, the expansion assembly having a plurality
of receiving members configured to move in at least two dimensions within
a single plane; and a plurality of microelectronic devices coupled to
each of the plurality of receiving members. |
| Filed: 3/12/2014 |
| Application Number: 14/205839 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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