| Abstract: A packaging structure and method for surface mount integrated circuits
reduces electrochemical migration (ECM) problems by including one or more
cleaning channels to effectively and efficiently remove flux residue that
may otherwise remain lodged in gaps between the surface mount package and
the printed circuit board. A cleaning channel may be formed along a
bottom surface of the surface mount package (i.e., the surface facing the
printed circuit board), or along a portion of a top surface of the
printed circuit board. In either case, the inclusion of a cleaning
channel enlarges the gap between the bottom surface of the surface mount
package and the printed circuit board and creates a path for contaminants
to be flushed out during a cleaning process. |
| Filed: 12/22/2016 |
| Application Number: 15/388210 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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