| Abstract: | A moldable photovoltaic module is provided. The module includes a
flexible polymeric flex-circuit substrate having an electrically
conductive printed wiring pattern and solder pads defined on it. Small
photovoltaic cells are affixed to the flex-circuit substrate by
back-surface contacts in electrical contact with the solder pads. At
least one thermoformable polymeric film is joined to the flex-circuit
substrate. Each said solder pad comprises a solder composition that,
after an initial melt, has a melting point that lies above at least a
portion of the temperature range for thermoforming the polymeric film. |