Microfluidic structures and methods for integrating a functional component into a microfluidic device
| Patent Number: | 7,351,380 |
| Issued: | 4/1/2008 |
| Official Filing: | View the Complete Patent |
| Abstract: | Injection molding is used to form microfluidic devices with integrated functional components. One or more functional components are placed in a mold cavity which is then closed. Molten thermoplastic resin is injected into the mold and then cooled, thereby forming a solid substrate including the functional component(s). The solid substrate including the functional component(s) is then bonded to a second substrate which may include microchannels or other features. |
| Filed: | 1/8/2004 |
| Application Number: | 10/754,286 |
| Government Interests: | STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |