Methods for fabricating a micro heat barrier

United States Patent

January 6, 2004
View the Complete Patent at the US Patent & Trademark Office
Methods for fabricating a highly effective, micron-scale micro heat barrier structure and process for manufacturing a micro heat barrier based on semiconductor and/or MEMS fabrication techniques. The micro heat barrier has an array of non-metallic, freestanding microsupports with a height less than 100 microns, attached to a substrate. An infrared reflective membrane (e.g., 1 micron gold) can be supported by the array of microsupports to provide radiation shielding. The micro heat barrier can be evacuated to eliminate gas phase heat conduction and convection. Semi-isotropic, reactive ion plasma etching can be used to create a microspike having a cusp-like shape with a sharp, pointed tip (<0.1 micron), to minimize the tip's contact area. A heat source can be placed directly on the microspikes. The micro heat barrier can have an apparent thermal conductivity in the range of 10.sup.-6 to 10.sup.-7 W/m-K. Multiple layers of reflective membranes can be used to increase thermal resistance.
Marshall; Albert C. (Sandia Park, NM), Kravitz; Stanley H. (Placitas, NM), Tigges; Chris P. (Albuquerque, NM), Vawter; Gregory A. (Albuquerque, NM)
Sandia Corporation (Albuquerque, NM)
December 19, 2001
216/2 ; 204/192.32; 204/192.34; 216/100; 216/11; 216/24; 216/41; 216/46; 216/66; 216/67; 216/83; 219/121.69;
B32B 031/00 ();
216/2,11,24,41,46,66,67,83,100 204/192.32,192.34 219/121.69
FEDERALLY SPONSORED RESEARCH The United States Government has rights in this invention pursuant to Department of Energy Contract No. DE-AC04-94AL85000 with Sandia Corporation.