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Method for tuning thermal expansion properties in an additive manufacturing feedstock material

United States Patent

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September 14, 2021
View the Complete Patent at the US Patent & Trademark Office
A feedstock material for use in an additive manufacturing apparatus is prepared from a first material and a metal organic framework (MOF). The MOF comprises a plurality of nodes and a plurality of linkers, the plurality of linkers coupled to the plurality of nodes, thereby forming a framework. The MOF has a lower coefficient of thermal expansion than a coefficient of thermal expansion for the first material. As a result, the feedstock material has a reduced coefficient of thermal expansion as compared to the first material alone and thus exhibits low thermal expansion as its temperature is increased. The coefficient of thermal expansion for the MOF may be modified by using a different plurality of nodes and/or a different plurality of linkers, as well as by incorporating guest molecules or atoms into the framework of the MOF.
15/ 717,265
September 27, 2017
B28B 1/00 (20060101)C22C 32/00 (20060101)B33Y 10/00 (20150101)B22F 10/00 (20210101)B33Y 70/00 (20200101)B29C 64/10 (20170101)B33Y 70/10 (20200101)C22C 1/05 (20060101)
STATEMENT OF GOVERNMENTAL INTEREST This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The U.S. Government has certain rights in the invention.