Microfabricated ion trap chip with in situ radio-frequency sensing

Patent Number: 11,056,332
Issued: 7/6/2021
Official Filing: View the Complete Patent
Abstract: A radio-frequency (RF) surface ion trap chip includes an RF electrode and an integrated capacitive voltage divider in which an intermediate voltage node is capacitively connected between the RF electrode and a ground. A sensor output trace is connected to the intermediate voltage node.
Filed: 3/17/2020
Application Number: 16/821,150
Government Interests: STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention.