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Integrated circuit authentication from a die material measurement

United States Patent

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March 9, 2021
View the Complete Patent at the US Patent & Trademark Office
The various technologies presented herein relate to measuring a signal generated by a die-based test circuit incorporated into an IC and utilizing the measured signal to authenticate the IC. The signal can be based upon a sensor response generated by the test circuit fabricated into the die, wherein the sensor response is based upon a property of the die material. The signal can be compared with a reference value obtained from one or more test circuit(s) respectively located on one or more reference dies, wherein the reference dies are respectively cut from different wafers, and the location at which the reference dies were cut is known. If the measured signal matches the reference value, the die is deemed to be from the same cut location as the dies from which the reference value was obtained. If the measured signal does not match the reference value, the die is not authenticated.
16/ 545,943
August 20, 2019
G01R 31/26 (20200101)H01L 21/26 (20060101)G01R 31/28 (20060101)H01L 21/66 (20060101)
STATEMENT OF GOVERNMENTAL INTEREST This invention was developed under contract DE-AC04-94AL85000 between Sandia Corporation and the U.S. Department of Energy. The U.S. Government has certain rights in this invention.