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Heating and cooling devices, systems and related method

United States Patent

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December 29, 2020
View the Complete Patent at the US Patent & Trademark Office
Embodiments disclosed herein relate to devices, systems, and methods for cooling and/or heating a medium as well as cooling and/or heating an environment containing the medium. More specifically, at least one embodiment includes a heat pump that may heat and/or cool a medium and, in some instances, may transfer heat from one location to another location.
16/ 546,465
August 21, 2019
F25B 30/02 (20060101)F25B 39/00 (20060101)
STATEMENT OF GOVERNMENT INTEREST This invention was developed under contract DE-AC04-94AL85000 between Sandia Corporation and the U.S. Department of Energy. The U.S. Government has certain rights in this invention.