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Kinematic chip to chip bonding

United States Patent

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April 14, 2020
View the Complete Patent at the US Patent & Trademark Office
The various technologies presented herein relate to integrating an IC having at least one waveguide incorporated therein with a v-groove array IC such that an optical fiber located in a v-groove is aligned relative to a waveguide in the IC maximizing optical coupling between the fiber and the waveguide. The waveguide IC and the v-groove array IC are bonded in a stacked configuration. Alignment of the waveguide IC and the array IC in the stacked configuration enables advantage to be taken of lithographic accuracy of features formed with respect to the Z-direction. Further, kinematic pins and sockets are utilized to provision accuracy in the X- and Z-directions, wherein advantage is taken of the placement accuracy and fabrication tolerance(s) which can be utilized when forming the and sockets. Accordingly, automated alignment of the waveguide IC and the array IC is enabled, facilitating accurate alignment of the respective waveguides and fibers.
15/ 084,164
March 29, 2016
G02B 6/30 (20060101)H01S 5/22 (20060101)H01S 5/12 (20060101)H01S 5/30 (20060101)H01S 5/022 (20060101)G02B 6/36 (20060101)G02B 6/42 (20060101)
STATEMENT OF GOVERNMENTAL INTEREST This invention was developed under contract DE-AC04-94AL85000 between Sandia Corporation and the U.S. Department of Energy. The U.S. Government has certain rights in this invention.