To address the current national emergency, U.S. entities may be eligible to license select Sandia intellectual property at no cost for a limited time. Learn more.

Search/Browse Tech

Electroless deposition of metal on 3D-printed polymeric structures

GO BACK

United States Patent

To discuss licensing opportunities, fill out our Contact Form 
10,494,721
December 3, 2019
View the Complete Patent at the US Patent & Trademark Office
A process for metallizing a three-dimensional-printed polymeric structure includes soaking the three-dimensional-printed polymeric structure in a metal salt solution; transferring the three-dimensional polymeric structure to a solution comprising a first reducing agent; soaking the three-dimensional polymeric structure in a metal plating bath, the metal plating bath comprising a coordinating agent, a palladium or platinum salt, a pH buffer component, and a second reducing agent, to form a metal plated polymeric structure. A metal plated porous structure and an apparatus for improving metallization are also disclosed.
15/671,345
August 8, 2017
1/1;
C23C 18/31 (20060101); C23C 18/16 (20060101); B33Y 10/00 (20150101); B33Y 80/00 (20150101);
STATEMENT OF GOVERNMENTAL INTEREST This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The U.S. Government has certain rights in this invention.