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Heating and cooling devices, systems and related method

United States Patent

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10,429,105
October 1, 2019
View the Complete Patent at the US Patent & Trademark Office
Embodiments disclosed herein relate to devices, systems, and methods for cooling and/or heating a medium as well as cooling and/or heating an environment containing the medium. More specifically, at least one embodiment includes a heat pump that may heat and/or cool a medium and, in some instances, may transfer heat from one location to another location.
14/857,652
September 17, 2015
1/1;
F25B 1/00 (20060101); F25B 30/02 (20060101); F25B 39/00 (20060101);
;62/324.1-324.4
STATEMENT OF GOVERNMENT INTEREST This invention was developed under contract DE-AC04-94AL85000 between Sandia Corporation and the U.S. Department of Energy. The U.S. Government has certain rights in this invention.