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Lateral vias for connections to buried microconductors and methods thereof

United States Patent

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April 16, 2019
View the Complete Patent at the US Patent & Trademark Office
The present invention relates to a lateral via to provide an electrical connection to a buried conductor. In one instance, the buried conductor is a through via that extends along a first dimension, and the lateral via extends along a second dimension that is generally orthogonal to the first dimension. In another instance, the second dimension is oblique to the first dimension. Components having such lateral vias, as well as methods for creating such lateral vias are described herein.
15/ 980,546
May 15, 2018
H01L 21/768 (20060101)H01L 23/00 (20060101)H01L 25/065 (20060101)H01L 23/48 (20060101)H01L 23/538 (20060101)H01L 21/48 (20060101)H01L 23/498 (20060101)H01L 23/31 (20060101)H01L 23/14 (20060101)
STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention.