High resolution, non-contact removal rate module for serial sectioning

Patent Number: 10,260,865
Issued: 4/16/2019
Official Filing: View the Complete Patent
Abstract: The present invention relates to a metallographic system including a measurement module configured to provide precise differential measurements of a sample after serial sectioning, as well as methods of employing such a module. In particular example, the measurement module provides differential measurement(s) without contacting the surface of a sample, thereby minimizing contamination of the sample surface.
Filed: 9/14/2017
Application Number: 15/705,178
Government Interests: STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention.